Photoresist Dry Film Plating Resist for Copper, Tin & Tin/Lead

DuPont PlateMaster 200 Dry Film

• Negative working, aqueous processable dry film photoresist.
• Designed for pattern plate applications on scrubbed and unscrubbed electroless copper, and Direct Plate surfaces.
• Strong mechanical scratch resistance for development and post development process to achieve high yields.
• Increased productivity (Photospeed, development speed and stripping speed).
• Improved dry film confonnation under conversional lamination parameters.
• Vivid print out image after exposure.
• Available in 40 micron(1.5mil), 50 micron(2.0 mil), and 75 micron(3.0mil) thicknesses.

DuPont PlateMaster 300 Photoresist Dry Film

• Negative working, aqueous processable dry film photoresist Designated for super fine line pattern plating application.
• Featured in wide plating latitude that can be processed at different plating condition without under plating.
• Stripping flake size is 3 mm which can be easily separated when over plated.
• Vivid print out image after exposure for east inspection.
• Available in ,38 and 50 micron thickness depend on plating thickness.

 

DuPont Riston Dry Film Selection Guide

 

• Click Here to Request More Information!
  Name(required)

  Email(required)

  Business

  Address

  Website

  Comments/Questions(required)