DuPont MultiMaster 100i

RistonĀ® MultiMaster MM100i has very strong resistance to lifting on all surfaces. It has been formulated
to be compatible with Incoming copper clad surfaces, scrubbed and unscrubbed electroless, direct
metallization processes and panel plated copper. The resist is designed to be used in the following
applications: acid and alkaline etch, tent and etch, copper, tin, tin/lead, nickel and gold plating.

 

DuPont MultiMaster 500i

RistonĀ® MultiMaster MM500 has very strong resistance to lifting on all surfaces. It has been formulated
to be compatible with incoming copper clad surfaces, scrubbed and unscrubbed electroless, direct
metalization processes and panel plated copper. The resist is designed to be used in the following
applications: acid and alkaline etch, tent and etch, copper, tin, tin/ lead, nickel and gold plating.

 

DuPont Riston Dry Film Selection Guide

 

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