DRY FILM FOR ACID & ALKALINE ETCH, COPPER, TIN & TIN/LEAD, NICKEL & GOLD

DuPont MultiMaster 100i

Riston® MultiMaster MM100i has very strong resistance to lifting on all surfaces. It has been formulated

to be compatible with Incoming copper clad surfaces, scrubbed and unscrubbed electroless, direct

metallization processes and panel plated copper. The resist is designed to be used in the following

applications: acid and alkaline etch, tent and etch, copper, tin, tin/lead, nickel and gold plating.

DuPont MultiMaster 500i

Riston® MultiMaster MM500 has very strong resistance to lifting on all surfaces. It has been formulated

to be compatible with incoming copper clad surfaces, scrubbed and unscrubbed electroless, direct

metalization processes and panel plated copper. The resist is designed to be used in the following

applications: acid and alkaline etch, tent and etch, copper, tin, tin/ lead, nickel and gold plating.

 

DuPont Riston Dry Film Selection Guide