Electra EMP110 Soldermask


CarapaceEMP110 has been used in the high volume

production of PCBs since 1987. The Carapace family

has been formulated to exceed the increasing

demands of PCB processes, combined with a large

process window. 

EMO 110



Carapace EMP110 is a contact exposure, aqueous

developing, liquid photoimageable soldermask, using

twocomponent epoxy technology to give high levels of

chemical resistance over copper, copper oxide,

tin-lead or gold plated circuits. Due to their resolution

capability, high dielectric strength and physical

resistance properties Carapace soldermasks are

used as solder resists and insulation coverings on all

types of printed circuits, particularly high-reliability,

double-sided and multilayer, fine line boards.

  • High resistance to low solids fluxes.
  • Electroless Nickel / immersion gold compatibility.
  • Fine solder dam resolution (50-75m, 2-3 mil).
  • Fast processing times allowing High throughput and productivity.
  • Low ionic contamination.
  • Solderball elimination.
  • Optimised rheological and coating properties for each method of application.
  • High moisture and insulation resistance
  • Excellent adhesion to flexible substrates.
  • No halogenated flame retardants.